Method of bonding a member to a thin plate

ABSTRACT

METHOD OF FRICTION BONDING A THICK SECTION MEMBER TO A THIN SECTION MEMBER, SUCH AS A THIN PLATE OR SHEET, WHEREIN A HEAT CONDUCTOR IS APPLIED TO ONE SIDE OF THE THIN SECTION MEMBER FOR COOLING PURPOSES WHILE THE OTHER SIDE OF SAID MEMBER HEATS TO BONDING TEMPERATURE ALONG WITH THE MATING SURFACE OF THE LARGER SECTION MEMBER. THE HEAT CONDUCTOR MAY BE A BLOCK OF HIGH HEAT CONDUCTING MATERIAL, A PERFORATED MEMBER HAVING A FLUID COOLANT FLOWING THERETHROUGH, A MEMBER WHICH DIRECTS A FLOW OF FLUID COOLANT AGAINST THE BACKSIDE OF THE THIN SECTION MEMBER, OR A MEMBER HAVING A LOW MELTING POINT. THE MEMBER HAVING A LOW MELTING POINT IS HELD IN CONTACT WITH THE THIN SECTION MEMBER BY A RAM AND SURROUNDED BY A FLOATING SLEEVE WHICH IS ALSO URGED AGAINST THE THIN SECTION MEMBER AND HAS AN END SLOTTED WHEREBY, WHEN THE HEAT CONDUCTING MEMBER HAVING A LOW MELTING POINT MELTS, THE MELTED MATERIAL FLOWS RADIALLY OUTWARDLY THROUGH THE SLOTS AND THE RAM CONTINUES TO FORCE THE MEMBER INTO CONTACT WITH THE WORKPIECE WHERE IT CONTINUES TO MELT, COOLING THE WORKPIECE BY THE HEAT OF FUSION.

DEFENSIVE PUBLICATION UNITED STATES PATENT OFFICE Published at therequest of the applicant or owner in accordance with the Notice of Dec.16, 1969, 869 O.G. 687. The abstracts of Defensive Publicationapplications are identified by distinctly numbered series and arearranged chronologically. The heading of each abstract indicates thenumber of pages of specification, including claims and sheets ofdrawings contained in the application as originally filed. The files ofthese applications are available to the public for inspection andreproduction may be purchased for 30 cents a sheet.

Defensive Publication applications have not been examined as to themerits of alleged invention. The Patent Office makes no assertion as tothe novelty of the disclosed subject matter.

PUBLISHED MARCH 27, 1973 T908,002 METHOD OF BONDING A MEMBER TO A THINPLATE Calvin D. Loyd, 5029 Melody Lane, Peoria, Ill. 61604 Filed June 1,1971, Ser. No. 148,343 Int. Cl. B23k 27/00 US. Cl. 29-4703 2 SheetsDrawing. 10 Pages Specification Method of friction bonding a thicksection member to a thin section member, such as a thin plate or sheet,wherein a heat conductor is applied to one side of the thin sectionmember for cooling purposes while the other side of said member heats tobonding temperature along with the mating surface of the larger sectionmember.

The heat conductor may be a block of high heat conducting material, aperforated member having a fluid coolant flowing therethrough, a memberwhich directs a flow of fluid coolant against the backside of the thinsection member, or a member having a low melting point. The memberhaving a low melting point is held in contact with the thin sectionmember by a ram and surrounded by a floating sleeve which is also urgedagainst the thin section member and has an end slotted whereby, when theheat conducting member having a low melting point melts, the meltedmaterial flows radially outwardly through the slots and the ramcontinues to force the memher into contact with the workpiece where itcontinues to melt, cooling the workpiece by the heat of fusion.

C. D. LOYD METHOD OF BONDING A MEMBER TO A THIN PLATE Filed June 1. 19712 Sheets-Sheet 1 INVENTOR CALVIN D. LOYD 173 c. D. LOYD METHOD OFBONDING A MEMBER TO A THIN PLATE Fued June 1, 1971 2 Sheets-Sheet a INVENTOR CALVIN D. LOYD

